C.A.PICARD® Japan hat während der „Highly-Functional Material Week“ vom 08. bis 10.05.2024 an der PLASTIC JAPAN in Osaka teilgenommen.
This fair is one of the world's most advanced exhibitions for the plastics industry.
It brings together all kinds of technologies, from raw materials and additives through to molding and processing machinery as well as recycling technologies. It is held twice a year, once in Osaka and once in Tokyo, and brings together manufacturers presenting their latest advanced plastic products, production facilities and recycling innovations. Approximately 21,000 people visited the exhibition over these three days, and far more customers than expected visited our booth.
This time, we exhibited the following products:
Gehäuse-Kamera: Eine von C.A.PICARD® entwickelte Kamera zur Prüfung des Gehäuseinneren. Traditionell mussten die Gehäuse demontiert werden, um ihre innere Oberfläche anzuschauen und zu prüfen, aber mit dieser Kamera ist es möglich Fotos zu machen, ohne das Gehäuse auseinanderzunehmen.
FDS (Flexible Dismantling System) with PLC control for the efficient removal of screw elements from the support shafts, with full protection for the screw elements, the support shafts and especially the operators (presented via promotional video and a small model of the FDS).
The next PLASTIC JAPAN will take place from October 29 to 31, 2024 in Tokyo. We look forward to welcoming many guests again at our booth then.