With a focus on AI and Smart Manufacturing, the International Electronics Circuit Exhibition (Shenzhen) (HKPCA Show) took place from December 3-5, 2025 in halls 3 - 8 of the Shenzhen World Exhibition & Convention Center (Bao’an). Under the motto „A Better Life with AI - New Business for Printed Circuit Boards“, the trade fair brought together 651 global exhibitors on 3,656 booths covering an area of 80,000 m2 of floor space.
Nine thematic areas were presented, including two newly added exhibition halls: „Hall for Packaging and Testing Technology“ and „Hall for Precision Accessories and Components“.
A complete production chain was showcased, from materials, production and assembly through to packaging and testing. Groundbreaking solutions involving multi-layer printed circuit boards, integrated circuit substrates, flexible PCBs, HDI PCBs, glass substrates, high-speed/high-frequency materials and complete semiconductor production workflows were displayed, providing the industry with a comprehensive overview of the latest technological advances.
The exhibition attracted 77,508 trade visitors from nearly 70 countries and regions. Alongside this, 38 conferences took place, drawing a total of 3,390 participants, with key events including the International Technical Conference and the Smart PCB: AI Trends & Innovations Conference.
C.A.PICARD® exhibited in Hall 8 at booth 8E27. We held in-depth discussions with customers and upstream/downstream partners, gaining valuable insights into the industry. Our key focus at the trade fair was clear: „AI Computing Power + High-End Substrates“ is emerging as the main growth driver of the PCB industry. AI is pushing printed circuit boards toward higher layer counts, higher frequency/speed, and greater reliability. Demand is currently rising sharply in four key areas:
AI Servers/Data Centers: The fastest-growing demand segment, with the PCB value per AI server increasing many times over compared to traditional servers.
Transmission Equipment: The rollout of 5G has cemented demand for high-frequency and high-speed PCBs, with each value per transmission station significantly higher than for 4G. The ongoing development of 6G technology will further increase demand for these products.
Consumer and Home Electronics: Premium-class smartphones and AR/VR devices continue to drive demand for advanced HDI and flexible PCBs.
Vehicle Electronics: The growing intelligence of eco-friendly vehicles is currently boosting demand for high-end PCBs such as domain controllers and BMS. Both PCB volume and value per vehicle have increased many times over compared to traditional combustion vehicles.