On October 16 and 17, 2025, we took part in the DieTechExpo 2025 in Prague.
The industry gathering, which until now had been held every two years as a technology forum in Strasbourg or Luxembourg, was held in Prague for the first time as a trade fair. This new format directly attracted 303 participants and visitors from 31 countries – from the USA to China.
At the Prague Congress Center, the world's leading manufacturers presented their latest developments around the production and use of stamping dies. Exhibitors used the opportunity to present trade visitors directly on site with innovative products that already meet the requirements for the demanding packaging solutions of tomorrow.
This year, for the first time, we used this excellent platform to present our high-precision stamping plates for flatbed die-cutting machines to an international expert audience.
Mit unseren Besuchern haben wir an den zwei Tagen sehr gute Gespräche über die Stanzformtechnologie mit Schwerpunkt auf die Verpackungsindustrie geführt. Unsere Kunden, selber System- und Lösungsanbieter sowie Maschinenhersteller, haben uns bestätigt, dass sie mit den von C.A.PICARD® gelieferten Produkten sehr zufrieden sind. Und im Nachgang vertieften sich die Kontakte mit potenziellen Kunden, die großes Interesse an unserem Produktportfolio zeigten.
The DieTechExpo is also intended to take place every two years. Work on organizing the next trade fair is already underway. We will certainly be there again.